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  4. High-Density Pixel Imaging Sensor Readout Electronics for Space Applications: A Design Overview
 
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High-Density Pixel Imaging Sensor Readout Electronics for Space Applications: A Design Overview

Author(s)
Minuti, M.
Sgrò, C.
Baldini, L.
Bellazzini, R.
Brez, A.
more
Subjects

ASIC

CMOS

electronics

high-reliability elec...

SEE

X-ray detectors

Date Issued
2023-08-25
Publisher
Multidisciplinary Digital Publishing Institute (MDPI)
Abstract
With the specialization of VLSI ASICs for front-end signal processing electronics, the customization of the control back-end electronics (BEE) has become critical to fully deploy the ASIC performance. In the context of space operations, with typical constraints on power and reliability, the design and qualification of such integrated systems present significant challenges. In this paper, we review the design and performance of the BEE systems after two years of operations in low Earth orbit (LEO); these systems read out the custom ASICs inside the gas pixel detectors, which are located at the heart of the imaging X-ray polarimetry explorer (IXPE), a NASA-ASI small explorer mission designed to measure X-ray polarization in the 2–8 keV energy range. © 2023 by the authors.
URI
https://hdl.handle.net/20.500.13025/6447
Journal
Electronics (Switzerland)
Issue
17
Volume
12
DOI
10.3390/electronics12173589
URL
https://www.mdpi.com/2079-9292/12/17/3589
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